Metalens Foundry Service
Fabrication of metalenses with rapid turnaround times
Rapid fabrication service for prototyping metalenses and metasurfaces
The Metalens Foundry Service is an extension of our NanoSOI Fabrication Service that specializes in the fabrication of metalenses and metasurfaces. Using state-of-the-art, high-throughput electron beam lithography, our foundry can manufacture various meta-optical elements comprised of high resolution subwavelength features with superior line-edge roughness and negligible stitching errors. Our anisotropic plasma etch process provides structures with high aspect ratios and smooth sidewalls, which translates to flexible metalenses with exceptional performance efficiency. Optional standard process steps such as oxide cladding deposition are available for our metalenses. We also offer custom substrate material options should it be desirable for your application.
The Metalens Foundry Service is accessible through custom dedicated runs, which offer metalens/metasurface fabrication with a variety of custom options. Timelines for these runs are flexible, and quotations are customized for each run. Multi-project wafer (MPW) runs are not yet available but are coming soon.
Looking for metalens fabrication services?
Please contact our support line to inquire about our metalens foundry service. We are happy to discuss pricing, design conception and verification, online design submission, and many other topics with you regarding metalenses/metasurfaces.
High quality metalens foundry for rapid-prototyping and high-resolution structures
Optics can be made for visible and near-infrared wavelengths with different materials available
Substrate:
Substrate |
Size |
Dimensions |
---|---|---|
Fused Silica | 500 μm | 1 cm x 1 cm
(custom sizes available upon request) |
Metalens:
Materials |
Thickness |
Design area |
---|---|---|
Amorphous Silicon | 760 nm
(custom thicknesses available) |
9 mm x 9 mm |
Available Process Options
Several of these processes are available in multi-project wafer (MPW) runs and dedicated runs; currently, these are only available in dedicated runs.

Silicon Device Layer
Feature sizes as small as 100 nm (aspect ratio up to 7.6:1) with high performance electron beam lithography. Available in dedicated runs.
Silicon metalens/metasurface structures, patterned with our state-of-the-art, high-throughput electron beam lithography (EBL) process, provide compact, lightweight, high-quality optics with small form factor in various quantities for a variety of applications in communications, computing, imaging, and sensing.

Oxide Coating (Protective)
Cladding oxide to protect metalens integrity and enhance device performance. Available in dedicated runs.
A protective coating can be added in the form of a high-quality silicon dioxide cladding. The thickness of the protective film is customizable.