EUV, X-Ray and visible light calibration standards
Customizable High-Resolution Calibration Standards
The ANT calibration standard was designed for the highest resolution requirements of X-Ray imaging systems with nanoscale features. Available for both soft and hard X-Ray regimes, EUV and optical setups.
Nested Ls or elbows allow for high resolution measurements with guaranteed pitch and efficiency. Down to 15 nm half-pitch on high resolution standard.
Siemen star patterns allow for calibration and accurate comparison of the resolution of optics for X-Ray and other imaging methods.
Applied Nanotools has included the USAF 1951 resolution test chart but with features in nanometres instead of micrometres.
These varying line and spaces are useful for inspection and determining the resolution of a system.
Hard X-ray Calibration Standards are useful for energies above 5000 eV with a standard thickness of 500-600 nm and features down to 25 nm for the HXR-CAL model and 2000 nm gold thickness with features down to 200 nm.
Soft X-ray Calibration Standards are useful for EUV and soft x-ray energies up to 2000 eV with a standard thickness of 200 nm and features down to 25 nm for the SXR-CAL model and down to 15 nm for the ultra-high resolution version.
TEM Calibration Standards are useful for TEM and SEM systems to determine the resolution of a system and other diagnostics. With a 50 nm thick membrane, these standards are useful for transmission and reflection modes.
Custom designs and logos can be added to designs, see pricing for more information on costs.
Our standard frame size is 5 mm x 5 mm. We also offer custom frame sizes. Membrane thickness can be down to 50 nm and silicon carbide membranes are available for those requiring long-lifetime membranes.
The dimensions of the our lightweight aluminum holder are 14 mm tall x 14 mm wide x 3 mm deep and simplify handling of the calibration standards.
The Standard Layout
Options (for different energies)
|EUV Free-standing silicon nanoUSAF1951 (>100 nm Si3N4u) (negative polarity, etched into Si3N4 membrane)||10-90 eV (124-14 nm)|
|Ultra-High Resolution Soft X-Ray Calibration Standard (70 nm Au) (15 nm half pitch)||100 - 500 eV|
|Soft X-Ray Calibration Standard (150 nm Au) (25 nm half pitch or better)||100 - 1000 eV|
|Hard X-Ray Calibration Standard (>600 nm Au) (40 nm half-pitch or better)||100 - 12000 eV|
• Nested L’s
• Siemen star patterns (large and small)
• Varying pitch gratings and mesh
• Nano USAF 1951
|Custom Logo (Max 50 µm2 area)|
|Low stress 50 nm silicon nitride membrane|
|Low stress 200 nm silicon carbide membrane|
|Fused Silica Substrate (~500 um thick) •Chrome metal on glass (positive tone-only) >60 nm thickness|
|Negative polarity (features transparent) • 40 nm minimum feature size (soft X-ray) • 80 nm minimum feature size (hard X-ray)|
|Custom chip sizes|